DL 600GBII
High Precision Grinding Machine for Semiconductor Wafer Production
- 10.4″ Color LCD Monitor
- Machine Work Light
- Complete Coolant System
- Chip and Coolant Splash Guarding (Full Coverage)
- 12″ Diameter Manual Chuck
- Lubrication System
- Grinding Unit
- Front Door Interlock
- Machine Arranged for 220V + 10%, 60Hz
- Machine Leveling Plate
Specifications subject to change without prior notice
